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In this video Chip forming process with thermal approach in ABAQUS has been investigated. All parts are modeled as three dimensional with thermal properties as conductivity, specific heat, expansion ….. to consider them variation. Dynamic temp-explicit procedure is is appropriate for this type of analysis. During the process temperature has changed and heat divided between cutter and piece . You can see some figures of this simulation at bellow
You can provide CAE ,INP,and English video files of this simulation here. The cost of these files is Seventeen Euros. you can click on the bellow bottom to beginning process
You can purchase the tutorial through a PayPal account, a Visa, or a Master card, just before payment,send me an email to this address: karampourp@gmail.com
??Did you use subroutine in these model
, I want to create same model but white subroutine related to thermal conductivity p equivalent plastic strain failure and ……
if can made it for me We will not disagree with the money
Why subroutine? Do you have heat source with non uniform behavior?If you have a new behavior like heat source in your model or new element type yes you can use subroutine